Microelectronic reliability models for more than moore nanotechnology products
نویسندگان
چکیده
منابع مشابه
Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging
For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products—Moore’s Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or a.k.a “More than Moore”. This paper presents pack...
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Introduction Most IC design engineers today are at the same stage when considering Design for Yield (DFY) and Design for Reliability (DFR) as they were when considering Design for Test (DFT) 20 years ago. Most engineers poorly understand them, there are few EDA tools to help them, and there is no consensus about whether it is even worthwhile. It is just one more Design for X that they don’t hav...
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ژورنال
عنوان ژورنال: Facta universitatis - series: Electronics and Energetics
سال: 2017
ISSN: 0353-3670,2217-5997
DOI: 10.2298/fuee1701001b